W29N02KWBIBE

Description

Winbond Electronics Corporation was founded in September 1987 in the Hsinchu Science Park, with its 12-inch wafer fab serving as the primary R&D and manufacturing base. The company’s process technologies span from 0.11μm to 70nm. Dedicated to the production and design of memory products, its operations are divided into three major divisions: the DRAM Product Business Group, the Memory IC Manufacturing Business Group, and the Flash Memory IC Business Group. Its core business activities include the R&D, design, manufacturing, sales, and after-sales service of integrated circuits and related products.

The main DRAM products include Specialty DRAM, as well as Mobile RAM series such as Pseudo SRAM and Low Power SDRAM, which are widely applied in four major sectors: consumer electronics, communications, computer peripherals, and automotive electronics. Additionally, the high-end DRAM-GDDR product line targets applications in personal computers, gaming consoles, and multimedia devices.

For flash memory products, the company focuses on mid-to-low-density Parallel and Serial NOR Flash, which are widely used in personal computers and peripherals, optical disc drives, wireless networks, DSL modems, DVD players, set-top boxes, and televisions.